Laser glass soldering method to join temperature-sensitive large component groups

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Date: Apr. 2013
From: Advanced Coatings & Surface Technology(Vol. 26, Issue 4)
Publisher: Frost & Sullivan
Document Type: Article
Length: 572 words
Lexile Measure: 1450L

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Sensitive component groups, such as, optical sensors used in medical devices, OLED (organic light-emitting diode) components or dye solar cells require reliable encapsulation to prevent water and oxygen from reaching the internal parts of the component. If either water or oxygen reaches the interior of the devices, the possibility of degrading the functionality of the device increases. This impaired functionality is not desirable as it reduces the performance of the device and its life. Conventionally, such components are joined with anodic or glass-frit bonding or they are simply glued together. These conventional joining methods are not stable and reliable over the long term. Also, the entire component group is heated when it is joined using conventional methods, thus making the joining method detrimental for bonding temperature sensitive components.

A team of researchers at the Fraunhofer ILT (Institute for Laser Technology) have developed a...

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Gale Document Number: GALE|A338525534