Uniform electrochemical deposition of copper onto self-assembled gold nanoparticles

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Date: Mar. 18, 2004
From: Journal of Physical Chemistry B(Vol. 108, Issue 11)
Publisher: American Chemical Society
Document Type: Article
Length: 67 words

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Abstract :

Assemblies of gold(core)/copper(shell) nanoparticles could be prepared through the electrochemical deposition of copper metal onto self-assembled gold colloids that are immobilized via an organic film onto conductive substrates. From a simplified model, we derive formulas for the criteria to ensure the deposition independence, demonstrating the required experimental conditions of particle size, assembly density, and the ratio of the surface concentration to the bulk concentration of depositing species.

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Gale Document Number: GALE|A124640445